Foldable Flex And Thinned Silicon Multichip Packaging Technology by John W Balde
USD 94.00 USD
Specifications
| Item Length | 9.3 in |
| Publication Year | 2003 |
| Type | Textbook |
| Format | Hardcover |
| Language | English |
| Item Height | 1 in |
| Author | John W. Balde |
| Features | Illustrated |
| Item Width | 6.1 in |
| Country Of Origin | United States |
| Number Of Pages | Xix, 347 Pages |
| ISBN | 9780792376767 |
A nice touch in this textbook is the final exam review section at the back.