Foldable Flex And Thinned Silicon Multichip Packaging Technology by John W Balde

Foldable Flex And Thinned Silicon Multichip Packaging Technology by John W Balde

USD 94.00 USD
SKU: 6MAOPqEC
GTIN: 9780792376767
Condition: Good

Specifications

Item Length9.3 in
Publication Year2003
TypeTextbook
FormatHardcover
LanguageEnglish
Item Height1 in
AuthorJohn W. Balde
FeaturesIllustrated
Item Width6.1 in
Country Of OriginUnited States
Number Of PagesXix, 347 Pages
ISBN9780792376767

A nice touch in this textbook is the final exam review section at the back.

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